Copper Aluminum Composite Liquid Cooling Module High Density Fins Multi Heat Pipe Industrial Grade High Power Heat Sink
| fan size: | NO | type: | Heatsink |
| application: | Heat Sink, Computer Case, Cpu, Heat Sink |
This industrial grade high power cooling module adopts 6 high thermal conductivity copper heat pipes and liquid cooling plate dual path design which can quickly transfer and remove 800W 1500W core heat perfectly suitable for new energy vehicle control industrial laser equipment high density servers and other high power scenarios Vacuum brazing process ensures no leakage risk of water cooling plate and IP65 waterproof and dustproof structure can cope with extreme industrial environments high density aluminum extrusion fins at the end combined with liquid cooling air cooling dual mode further enhance heat dissipation efficiency to avoid device overheating and throttling We provide full customization service to adjust dimensions heat pipe quantity water cooling plate channels and mounting holes according to customer requirements The product has passed strict industrial grade reliability tests with a service life of over 50000 hours providing stable and efficient thermal management solutions for high reliability equipment





