Exibição de calor de perfis de alumínio&Refrigerador de cartão gráfico GPU Fabricante
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Product descriptions from the supplier This high power aluminum alloy server heatsink is made of high quality 6063 aluminum alloy with precision machining. It is specially designed for high end servers industrial power modules and other equipment with max 300W to 600W TDP cooling power. Fanless passive structure realizes zero noise and zero power consumption. Support custom size mounting holes and structure compatible with multi platform equipment. Widely used in data centers
Product descriptions from the supplier High Performance Cooling: Effective heat dissipation for mini PC stability. Copper Heatsink: Enhanced thermal conductivity for superior cooling performance. Industrial Control Application: Ideal for professional-grade cooling solutions. About this supplier Huizhou Xunzhan Electronics Co., Ltd.Since its establishment, Huizhou Xunzhan Electronics Co., Ltd. has been committed to providing one-stop thermal module solutions including design,
Product descriptions from the supplier Key Selling Points High-Efficiency Thermal Conduction: Adopts precision soldering of multiple high-conductivity pure copper heat pipes and copper heat absorption bases, quickly transferring heat from core heat sources such as CPU/GPU, with cooling efficiency improved by over 40% compared to traditional extrusion aluminum heat sinks. Dual Heat Source Independent Design: Supports simultaneous heat dissipation for dual chips (e.g., CPU+GPU)
Product descriptions from the supplier High Efficiency Thermal Conduction: Precision soldered pure copper heat pipes + high-density aluminum fins, cooling efficiency improved by over 50% High Power Capacity: Supports 150W~350W TDP, ideal for high-load devices like servers, gaming consoles & AIO PCs Fully Customizable: Customizable heat pipe quantity, fin size, base shape & mounting holes to fit your device Stable & Durable: Lead-free soldering process, anti-vibration & anti
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Huizhou Xunzhan Electronics Co., Ltd.
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